Multilayer thick-film hybrid circuits method and process for constructing same

作者： Adrien Leroux , Alexandre Kocsis , George D. Lane

DOI:

关键词: Polishing 、 Electronic circuit 、 Sublimation (phase transition) 、 Inkwell 、 Electronic engineering 、 Dielectric 、 Dielectric layer 、 Conductor 、 Materials science 、 Composite material

摘要: A method and process of screening multilayer thick-film structures to produce complex hybrid electronic circuits. After deposition, drying firing the first conductor plane on substrate, registration ink is deposited allowed dry thus forming temporary vias. suitable dielectric paste then either all surface or except viaslocations. The dried fired. Firing however causes sublimation evaporation vias pattern leaving cavities in layer. Slight buffing may be required uncover via holes. second are deposited, same steps carried out for each subsequent plane.