Anisotropically conductive adhesive

摘要: PROBLEM TO BE SOLVED: To obtain an anisotropically conductive adhesive which can bond circuits to each other at a relatively low temp. in short time and exhibits improved connection reliability storage stability by dispersing particles insulating component comprising free-radical- polymerizable resin, org. peroxide, epoxy curative, thermoplastic elastomer. SOLUTION: The is prepd. compounding 100 pts.wt. free-radical-polymerizable resin (e.g. unsatd. polyester diallyl phthalate vinyl ester or bismaleimide resin) with 0.1-10 peroxide having 1-min half-life of 90-150°C, 5-200 least 2 groups, 5-300 curative for 10-200 elastomer carboxylated styrene- butadiene copolymer). Conductive Fe, Ni, Co, Sn) amt. 0.1-5vol.% are dispersed the component. COPYRIGHT: (C)1998,JPO