Simulation Research on Cutting Process of Single Abrasive Grain Based on FEM and SPH Method

作者: Chong Su , Jiang Min Ding , Li Da Zhu

DOI: 10.4028/WWW.SCIENTIFIC.NET/AMR.186.353

关键词: Material ProtrusionExtrusionMetallurgyMaterials scienceFinite element methodAbrasiveDeformation (engineering)GrindingSmoothed-particle hydrodynamicsRake angle

摘要: Cutting process of single abrasive grain was simulated by Smoothed Particle Hydrodynamics and Finite Element Method. Chip mechanism analyzed according to the stress variation workpiece material, motion situation smoothed particles in cutting layer. Effects rake angle depth on deformation material were also analyzed. It is concluded that occurs plastic deformation, flows side front owing extrusion grain, finally forms chip grain; capability increases with increase angle, it results protrusion rain relatively decrease beside force depth. Scratching experiment grains carried out using vitrified bonded CBN block. found laws simulation are consistent. proved correct, method feasible

参考文章(6)
M Yoshino, T Aoki, T Shirakashi, R Komanduri, Some experiments on the scratching of silicon:: In situ scratching inside an SEM and scratching under high external hydrostatic pressures International Journal of Mechanical Sciences. ,vol. 43, pp. 335- 347 ,(2001) , 10.1016/S0020-7403(00)00019-9
Junichi Tamaki, T.A. Mahmoud, Ji Wang Yan, G. Sato, Toshirou Iyama, Effect of Cutting-Edge Shape on Ductile Regime Grinding of Optical Glass in Single-Grit Diamond Grinding Key Engineering Materials. pp. 89- 94 ,(2004) , 10.4028/WWW.SCIENTIFIC.NET/KEM.257-258.89
K.E. Puttick, L.C. Whitmore, P. Zhdan, A.E. Gee, C.L. Chao, Energy scaling transitions in machining of silicon by diamond Tribology International. ,vol. 28, pp. 349- 355 ,(1995) , 10.1016/0301-679X(95)00019-Z
V. Jardret, H. Zahouani, J.L. Loubet, T.G. Mathia, Understanding and quantification of elastic and plastic deformation during a scratch test Wear. ,vol. 218, pp. 8- 14 ,(1998) , 10.1016/S0043-1648(98)00200-2