Coating process comprises depositing layer on substrate, contacting evaporating materials at the substrate, supplying evaporators for heating the material by electric current, and detecting ripples of electrical parameters in evaporators

摘要: The coating process comprises depositing a layer (42) on substrate (40), contacting evaporating materials from an evaporator unit (20) the substrate, supplying evaporators (22) for heating material by electric current, introducing during current flow into unit, detecting ripples, which are caused supplied material, of electrical parameters in and/or layer-related parameter layer, evaluating ripples parameter, and adjusting correcting variable unit. at with respect to collected ripples. Current, voltage, power, resistance evaporators, voltage between surface or thickness deposited is detected ripple parameter. A standard deviation distance minimum maximum signal detected. changed while exceeding permissible distance. operated direct alternating current. low-frequency portion below 20 cycles per second. power regulated value limited values. An independent claim included device deposition substrate.