Use of graphene oxide in achieving high overall thermal properties of polymer for printed electronics

作者: Tianle Zhou , Fei Liu , Katsuaki Suganuma , Shijo Nagao

DOI: 10.1039/C5RA24669E

关键词: GrapheneEpoxyComposite materialThermal expansionThermal stabilityThermal conductivityPolymerGlass transitionPrinted electronicsMaterials science

摘要: Heat removal and “simultaneous” thermal stability are vitally important for the high performance long-term reliability of printed electronics. However, such a demand is challenging, because heat-conductive reinforcements also “simultaneously” encourage expansion/degradation polymeric materials. To restrict motion polymer chains (the key achieving increased glass transition temperature (Tg) thus enhancing stability), chemical modifications often used to intensify reinforcement/polymer interfacial interactions, but they deteriorate intrinsic conductivity reinforcements. Herein, this deadlock broken. Moreover, no chemicals needed. We reveal an inherent superiority ‘thick’ graphene oxide nanoplatelet (GONP) in both Tg its associated dimensional structural epoxy, with particular emphasis on enabling conductivity-reinforcing capability GONPs make “positive” contribution enhancement epoxy. The strong GONP/epoxy interaction formed was verified by “local” mechanical properties investigated using nanoindentation. GONP based specialty layered-structure can be extended various GONP-like endowing materials overall

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