作者: Tianle Zhou , Fei Liu , Katsuaki Suganuma , Shijo Nagao
DOI: 10.1039/C5RA24669E
关键词: Graphene 、 Epoxy 、 Composite material 、 Thermal expansion 、 Thermal stability 、 Thermal conductivity 、 Polymer 、 Glass transition 、 Printed electronics 、 Materials science
摘要: Heat removal and “simultaneous” thermal stability are vitally important for the high performance long-term reliability of printed electronics. However, such a demand is challenging, because heat-conductive reinforcements also “simultaneously” encourage expansion/degradation polymeric materials. To restrict motion polymer chains (the key achieving increased glass transition temperature (Tg) thus enhancing stability), chemical modifications often used to intensify reinforcement/polymer interfacial interactions, but they deteriorate intrinsic conductivity reinforcements. Herein, this deadlock broken. Moreover, no chemicals needed. We reveal an inherent superiority ‘thick’ graphene oxide nanoplatelet (GONP) in both Tg its associated dimensional structural epoxy, with particular emphasis on enabling conductivity-reinforcing capability GONPs make “positive” contribution enhancement epoxy. The strong GONP/epoxy interaction formed was verified by “local” mechanical properties investigated using nanoindentation. GONP based specialty layered-structure can be extended various GONP-like endowing materials overall