Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals

摘要: Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form delamination and cracking films, which has not been investigated quantitatively or systematically. Here, we directly measured interfacial fracture energy silver using double cantilever beam mechanics testing. It was demonstrated that thermal annealing temperature period affect energy. Also it found resistance can be maximized with optimized conditions formation organic residual bridges during process.