Epoxy resin compositions, solid state devices encapsulated therewith and method
作者： Slawomir Rubinsztajn , Malgorzata Iwona Rubinsztajn
DOI:
关键词: Boron containing 、 Curing (chemistry) 、 Solid-state 、 Epoxy 、 Cycloaliphatic epoxy 、 Materials science 、 Polymer chemistry 、 Catalysis
摘要: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) anhydride curing agent, (C) a boron containing catalyst that is essentially free of halogen, (D) cure modifier, and, optionally (E) ancillary catalyst. The encapsulant may also thermal stabilizers, UV coupling agents, or refractive index modifiers. Also packaged solid state devices comprising package, chip, and an composition the invention. A method encapsulating device provided.
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