Method and apparatus for underfilling semiconductor devices
作者： Thomas Laferl Ratledge , Horatio Quinones , Liang Fang
DOI:
关键词: Convection 、 Temperature gradient 、 Substrate (printing) 、 Materials science 、 Differential heat 、 Semiconductor device 、 Die (integrated circuit) 、 Thermal conduction 、 Electronic engineering 、 Radiation 、 Composite material
摘要: A method and apparatus for underfilling a gap between multi-sided die substrate with an encapsulant material. The and/or the is heated non-uniformly by heat source to generate temperature gradient therein. one of transfers energy in proportion material moving gap. differential transfer steers, guides or otherwise directs movement may be established transferred from conduction, convection, radiation. dynamically varied as moves into
google.nl 参考文章(29)
Craig Mitchell, Thomas H. DiStefano, System for encapsulating microelectronic devices ,(1998)
Yumiko Ohshima, Takahito Nakazawa, Flip-chip semiconductor package ,(1997)
Hans-Joachim Steindorf, Device for filling molds with a casting resin and the like ,(1991)
Anthony M. Chiu, Apparatus and method for automating the underfill of flip-chip devices ,(1999)
Kingshuk Banerji, Francisco D. Alves, Robert F. Darveaux, Vacuum infiltration of underfill material for flip-chip devices ,(1991)
Kuo K. Wang, Sejin Han, Pressurized underfill encapsulation of integrated circuits ,(1996)
Stanley C. Beddingfield, John C. Gentile, Leo M. Higgins, Process for underfilling a flip-chip semiconductor device ,(1995)
Manickam Thavarajah, Stephen A. Murphy, Galen C. Kirkpatrick, Sunil A. Patel, Vacuum assisted underfill process and apparatus for semiconductor package fabrication ,(1997)
Susan A. Henry, Michael J. White, Inositol-excreting yeast ,(1992)