作者: R. J. Tomlin , R. Cimpeanu , D. T. Papageorgiou
DOI: 10.1103/PHYSREVFLUIDS.5.013703
关键词: Heat transfer 、 Electrohydrodynamics 、 Multiphysics 、 Materials science 、 Composite material 、 Substrate (electronics) 、 Wetting 、 Direct numerical simulation 、 Instability 、 Electric field
摘要: The multiphysics problem of a liquid film wetting an inclined substrate under the influence stabilizing electric field is considered. use spatial stability analysis to predict threshold dripping suppression assessed via reduced-order modeling and direct numerical simulation.