Process for filing micro-blind vias
作者： Kai-Jens Matejat , Oswald Igel , Herko Genth , Bernd Ottmar Roelfs , Akif Özkök
DOI:
关键词: Plating 、 Printed circuit board 、 Current density 、 Chemistry 、 Oxidizing agent 、 Inorganic chemistry 、 Galvanic cell 、 Galvanic bath 、 Electrolyte 、 Direct current
摘要: The invention provides a process for filling µ-blind vias in the manufacture of printed circuit boards, which comprises following steps: (i) providing bath electrolyte galvanic plating with metallic coatings comprising copper metal salt and optionally organic additives, (ii) operating direct current density 0.5 to 10 A/dm2, or pulses at an effective (iii) withdrawing part from bath, (iv) adding oxidizing agent has been withdrawn, (v) irradiating withdrawn UV light (vi) recycling replacing additives destroyed by oxidation treatment.
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