Corrosion and adhesion of multilayer pad structures for packaging applications

摘要: Corrosion resistance and adhesive strength for different multilayer pad structures used in electronic packaging applications are examined. In particular, with Cr/Cu interfaces compared to similar Cr/Ni/Cu containing a layer of Ni between the Cr Cu layers. Structures found be susceptible delamination following exposure highly corrosive conditions. apparently results formation crack initiators at edge structure. interlayers layers very effectively reduce this susceptibility because mutual solubility both causes better by interlocking >