Structural Analysis of Electroplated Amorphous-Nanocrystalline Ni-W

作者: Peter Schloßmacher , Tohru Yamasaki

DOI: 10.1007/S006040050074

关键词: Recrystallization (metallurgy)Amorphous solidMetallurgyNanocrystalline materialCrystallizationMicrostructureMaterials scienceAnnealing (metallurgy)IntermetallicCopper

摘要: Ductile nickel-tungsten (Ni-W) alloys containing about 20–21 at.%W were electroplated onto copper substrates. The development of the amorphous/nanocrystalline microstructure towards a complete crystallization by isochronal heat treatments in vacuum was monitored different methods. For medium annealing temperatures solid-solution W fcc-Ni lattice achieved resulting an increased hardness. 600 °C and upward recrystallization started thermodynamically stable intermetallic compounds like Ni4W NiW formed. A third phase, more than 80 at.%W also detected but could not be identified so far. Only combination methods especially use analytical TEM structural analysis phase identification these amorphous-nanocrystalline Ni-W successful.

参考文章(1)
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