Applying different pressures through sub-pad to fixed abrasive cmp pad

摘要: A chemical mechanical polishing (CMP) system includes a rotating table including platen providing at least two pressure zones having different pressures; sub-pad positioned on the platen, plurality of openings allowing for transmission pressures therethrough; fixed abrasive pad sub-pad; and pressure-creating sealingly coupled to creating in zones, wherein create topography pad. related method are also provided.