MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要: PURPOSE:To divide a solder-material sheet uniformly during heating process, and to supply each semiconductor element equally with solder material by forming grooves or notch sections in boundary regions among sheets. CONSTITUTION:A large number of elements consisting n type layers 2 p 3, upper lower Ni electrodes 4, 5 protective 6 made glass for passivation, mesa silicon diode 7, are formed wafer 1, 8 division the back. The conductive memer 10 11 superposed. That is, member is entered into recessed section an carbon jig 14, arranged on 10, 1 15 disposed, whole turned up, introduced gas funace having N2 atmosphere melt 11, soldered 4. When bonded electrode 4 approximately equal quantity 16, divided several 7 along scribe, thus obtaining i.e. chips.