Electroless Plating of Copper and Nickel on Surface-Modified Poly(tetrafluoroethylene) Films

摘要: Chemical modification of Ar plasma-pretreated poly(tetrafluoroethylene) (PTFE) film by UV-induced graft copolymerization with glycidyl methacrylate (GMA), followed reactive coupling 3-aminopropyltriethoxysilane (APS), or immobilization polyaniline (PANI) chains had been carried out to improve the adhesion electrolessly deposited copper and nickel PTFE film. The surface compositions microstructures modified films were characterized X-ray photoelectron spectroscopy (XPS) atomic force microscopy (AFM), respectively. PANI-modified was susceptible electroless deposition in absence sensitization SnCl 2 . strength silane-modified metal affected concentration GMA polymer, plasma post-treatment, graft-modified surface, extent thermal post-treatment after metallization, optimum T-peel on graft-copolymerized APS-coupled could reach about 13 N/cm. This represented a more than tenfold increase over that obtained when treatment alone, mechanisms enhancement, stability cohesive failure metal-PTFE interface also investigated.