Component to cooling body thermal coupling appts. for integrated electronic component
作者： Herres Karl Dipl Ing
DOI:
关键词: Heat transfer 、 Surface (mathematics) 、 Free play 、 Composite material 、 Optics 、 Thermal coupling 、 Component (thermodynamics) 、 Electronic component 、 Chemistry
摘要: The planes of thermally contacted surfaces deviate from parallelity and rated spacing. There are two complementary, free play containing, meandering, interengageable heat transfer sections (2,3), one being (2) rigidly secured to a cooling body (1). other section (3) is spring-loaded against the component (4) surface. Pref. sum opposite surface parts greater for each than component.
lens.org 参考文章(2)
Noriyuki Ashiwake, Nobuo Kawasaki, Takahiro Daikoku, Shizuo Zushi, Kuehlvorrichtung fuer elektronische einrichtungen ,(1989)
Tibor Dipl Ing Dr Salanki, Guenter Waedt, Wolfgang Faehnrich, Cooling socket for an electrical component ,(1984)