Diffusion bonding utilizing transient liquid phase

作者: William A Owczarski , Daniel F Paulonis , David Scott Duvall

DOI:

关键词: Diffusion (business)HomogeneousThermocompression bondingLiquid phaseComposite materialForensic engineeringDiffusion bondingMaterials scienceAlloyTransient (oscillation)

摘要: Diffusion bonding is effected utilizing a thin alloy interlayer which melts at the desired diffusion temperature forming transient liquid phase and subsequently resolidifies as result of constituent interdiffusion, continued heat treatment providing homogeneous solid-state bond.

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