Improved physical understanding of intermittent failure in continuous monitoring method

摘要: Accelerated reliability tests are used to evaluate product life and ensure a good fit with mission profile. Adequate detecting failure methods criteria fundamental the validity of test results. In electronic interconnect tests, several types in-situ electrical continuity or manual resistance measurements crack length analyses as indicator. Continuous monitoring at high sampling rate shows intermittent signals before permanent failure. this paper we present new approach improving physical understanding these failures. Two different benches monitor BGA component solder joints under stress. Cross-section analysis, circuit models signal analysis highlight relationship between propagation continuity. Finally, basic electric contact theory is applied explain value fluctuations The results suggest that have be in order an appropriate criterion consequently more representative for interconnects field.