Large-scale integrated circuit with integral bi-directional test circuit

作者： Fred K. Buelow , John J. Zasio

DOI:

关键词: Small Outline Integrated Circuit 、 Electronic circuit 、 Integrated circuit 、 Process corners 、 Electronic engineering 、 Electrical element 、 Integrated circuit packaging 、 Pin compatibility 、 Electrical engineering 、 Engineering 、 Discrete circuit

摘要: A large scale integrated circuit with external integral access test circuitry having a semiconductor body surface. is formed in the through surface and comprises number of interconnected elements input output pads connected to disposed near outer perimeter body. An extends The has plurality probe carried by circuit. but relatively close proximity Leads are provided on which connect whereby can be obtained probing ascertain characteristics