Surface melting of a substrate prior to plating
作者： Clifton W. Draper , Satya P. Sharma
DOI:
关键词: Laser 、 Surface roughness 、 Plating 、 Electrical contacts 、 Substrate (electronics) 、 Copper 、 Electroplating 、 Layer (electronics) 、 Materials science 、 Metallurgy
摘要: Substrates for use in electrical contacts are prepared prior to plating by rapid surface melting means of a laser beam or an electron beam. Improved microscopic characteristics obtained. In preferred embodiment, improved macroscopic roughness also obtained shorter-duration melting, typically pulsed YAG laser. Gold which has been electroplated onto copper alloys this technique shown resistance sulfur and chlorine corrosive atmospheres. This allows, example, thinner layer protective metal be used obtain given degree protection.
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