Automated inspection system for residual metal after chemical-mechanical polishing
作者： Michael J. Berman
DOI:
关键词: Materials science 、 Process (computing) 、 Integrated circuit 、 Optoelectronics 、 Substrate (printing) 、 Radiation 、 Polishing 、 Chemical-mechanical planarization 、 Residual 、 Signal
摘要: An automated endpoint detection process for detecting residual metal on a surface of an integrated circuit substrate after subjecting said to chemical-mechanical polishing is described. The includes obtaining baseline reflected radiation signal standard that substantially free metal, directing generated from source at least portion the substrate, resulting and comparing thereby determining whether present substrate.
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