作者: Kunio Hosoya , Saishi Fujikawa , Satohiro Okamoto
DOI:
关键词: Base (geometry) 、 Engineering 、 Electrical engineering 、 Semiconductor device
摘要: The present invention provides a semiconductor device which is formed at low cost and has great versatility, manufacturing method thereof, further with an improved yield, thereof. A structure, base including plurality of depressions having different shapes or sizes, IC chips are disposed in the fit depressions, formed. selectively includes function accordance application, by using can be manufactured cost.