Ceramic and Glass‐Ceramic Packaging in the 1990s
作者： Rao R. Tummala
DOI: 10.1111/J.1151-2916.1991.TB04320.X
关键词: Polymer 、 Borosilicate glass 、 Mullite 、 Electronics 、 Nitride 、 Materials science 、 Porosity 、 Glass-ceramic 、 Ceramic 、 Composite material
摘要: A broad overview of packaging involving interconnecting, powering, protecting, and cooling semiconductor chips to meet a variety computer system needs is presented. The general requirements for ceramics in terms their thermal, mechanical, electrical, dimensional control are presented, both high-performance low-performance applications. Glass-ceramics identified as the best candidates systems, aluminum nitride, alumina, or mullite systems. Glass-ceramic/copper substrate technology discussed an example ceramic use 1990s. Lower-dielectric-constant such composites silica, borosilicate, cordierite, with without polymers porosity, projected potential materials by year 2000.
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