作者: Yuan Liang , Hao Yu , Jincai Wen , Anak Agung Alit Apriyana , Nan Li
DOI: 10.1038/SREP30063
关键词: Surface plasmon polariton 、 CMOS 、 Optoelectronics 、 Energy conversion efficiency 、 Impedance matching 、 Coplanar waveguide 、 Wideband 、 Transmission line 、 Electrical impedance 、 Materials science
摘要: An on-chip low-loss and high conversion efficiency plasmonic waveguide converter is demonstrated at sub-THz in CMOS. By introducing a subwavelength periodic corrugated structure onto the transmission line (T-line) implemented by top-layer metal, surface plasmon polaritons (SPP) are established to propagate signals with strongly localized surface-wave. To match both impedance momentum of other components TEM-wave propagation, mode featured smooth bridge between Ground coplanar (GCPW) 50 Ω SPP T-line proposed. further reduce area, ultimately simplified gradual increment groove gradient. The proposed T-lines designed fabricated standard 65 nm CMOS process. Both near-field simulation measurement results show excellent from quasi-TEM modes broadband frequency range. achieves wideband matching (<−9 dB) (averagely −1.9 dB) 110 GHz–325 GHz. compact have shown great potentials replace existing waveguides as future THz interconnects. best author’s knowledge, this first time demonstrate (sub)-THz technology.