Cooling device for electronic components
作者： Hung-Tai Ku , Yang-Kuo Kuo , Chia-Yi Hsiang
DOI:
关键词: Electronic component 、 Materials science 、 Temperature difference 、 Nitride 、 Aluminium 、 Substrate (electronics) 、 Thermoelectric effect 、 Optoelectronics 、 Power (physics)
摘要: A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum substrate) and utilizing the temperature difference generated by two top bottom ends to effectively remove heat components. This not only can reduce components, but also store power its thermoelectric effect.
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