System and method for disassembling laminated substrates
作者： Vincent P. Marzen , Tracy J. Barnidge , Paul R. Nemeth , James D. Sampica
DOI:
关键词: Tension (physics) 、 Layer (electronics) 、 Substrate (printing) 、 Materials science 、 Composite material
摘要: An apparatus for separating a laminated substrate assembly comprises at least substantially planar assembly, cutting member housing positioned on first side of the receiving second opposite from suitable an amount elongated member. At one or is configured to provide tension as released by received and remove adhesive layer assembly.
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