作者: Hao Zhang , Xiaowen Zhang , Zhou Fang , Yao Huang , Hong Xu
DOI: 10.3390/JCS4040180
关键词: Finite element method 、 Filler (packaging) 、 Polymer 、 Composite material 、 Electronics 、 Miniaturization 、 Electrical conductor 、 Thermal conductivity 、 Materials science 、 Thermal conduction
摘要: At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high …