A review about the filling of TSV
作者： Tao Chen , Jiadong Sun , Riming Yan
DOI: 10.1109/ICEPT.2015.7236716
关键词: Process research 、 Copper plating 、 Process engineering 、 Electronic packaging 、 Engineering drawing 、 Materials science
摘要: … [54] Shuai Shi, Xuefang Wang, Chunlin Xu, "Simulation and fabrication of two Cu TSV electroplating methods for wafer-level 3D integrated circuits packaging," Sensors and actuators A …
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