Rapid electroplating of insulators

摘要: Electrochemical techniques for depositing metal films and coatings have a long history. Such essentially fall into two categories, with different advantages disadvantages. The first, oldest, makes use of spontaneous redox reactions to deposit from solution, can be used on both insulating metallic substrates. But the deposition conditions these processes are difficult control in situ, part because variety salts additives present solution. second approach-electroplating-uses an electric current reduce ions offers over quantity (and, some extent, grain size) deposited metal. application this technique has hitherto been restricted conducting Here we describe electroplating that permits coating substrates metals having controlled size, thickness growth speed. basis our approach is progressive outward electrode contact substrate, cell geometry chosen so electron providing reduction passes through growing deposit. would normally form dendritic or powdery deposits, but identify range which uniform rapidly form.