Three-dimensional micro-coils in planar substrates

摘要: A three-dimensional micro-coil situated in a planar substrate. Two wafers have metal strips formed them, and the are bonded together. The connected such fashion to form coil encompassed within wafers. Also, sheets on facing surfaces of result capacitor. may be single or multi-turn configuration. It also toroidal design with core volume created by etching trench one before for wafer. capacitor can interconnected resonant circuit An external impedance measurement, among other things, processor chip.