Void-free wafer bonding using channels
作者： Vage Oganesian , Piyush Savalia , Ilyas Mohammed , Craig Mitchell , Belgacem Haba
DOI:
关键词: Electrical element 、 Engineering drawing 、 Dielectric 、 Microelectronics 、 Materials science 、 Thermal expansion 、 Composite material 、 Void (astronomy) 、 Pressing 、 Wafer bonding
摘要: A method of bonding first and second microelectronic elements includes pressing together a substrate 100 containing active circuit 108 therein with 112, flowable dielectric material 102 between confronting surfaces the respective substrates, each substrates 100,112 having coefficient thermal expansion less than 10 parts per million/ °C, at least one plurality channels 118A-118F extending from an edge such surface, that planes defined by is substantially free voids has thickness over micron, some flows into channels.
lens.org 参考文章(15)
Masataka Mizukoshi, Yasuo Yamagishi, Keishiro Okamoto, Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure ,(2003)
Warren M. Farnworth, Trung Tri Doan, Alan G. Wood, Wafer level semiconductor component having thinned, encapsulated dice and polymer dam ,(2005)
Janice Danvir, Jing Qi, Tomasz Klosowiak, Wafer coating and singulation method ,(2002)
Viraj A. Patwardhan, Nikhil Kelkar, Hau T. Nguyen, Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages ,(2005)
Jerzy M. Zalesinski, Joseph A. Benenati, William T. Chen, Wayne J. Howell, Thomas E. Dinan, John U. Knickerbocker, Wayne F. Ellis, William R. Tonti, Claude L. Bertin, Mark V. Pierson, Rolling ball connector ,(2001)
Yasuhiro Naka, Hiroaki Ikeda, Naoya Kanda, Masakazu Ishino, Hiroyuki Tenmei, Kunihiko Nishi, Method for manufacturing a three-dimensional semiconductor device and a wafer used therein ,(2007)
Shinsuke Nakajyo, Masamitsu Ikumo, Masanori Onodera, Mounting substrate and mounting method for semiconductor device ,(2000)
Kiyofumi Sakaguchi, Takao Yonehara, Method for producing semiconductor substrate by wafer bonding ,(1997)
Robert Leydier, Beatrice Bonvalot, Laurent Le Moullec, Sylvie Barbe, Method of fixing a sealing object to a base object ,(2002)
Philip R. Germann, Andrew B. Maki, Gerald K. Bartley, Mark O. Maxson, Paul E. Dahlen, Darryl J. Becker, Method and structure for dispensing chip underfill through an opening in the chip ,(2007)