Thermal Stresses in Layered Electronic Assemblies
作者： Z. Q. Jiang , Y. Huang , A. Chandra
DOI: 10.1115/1.2792218
关键词: Electronic assemblies 、 Materials science 、 Euler–Bernoulli beam theory 、 Thermal 、 Mechanics
摘要: … present study is to provide a reasonably accurate but simple estimation of peeling stress, as … to the layers. Therefore, it can provide a reasonably accurate estimation of peeling stress in …
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sci-hub.se 参考文章(18)
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