Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000
作者： Nokia , Marika Hyytiäinen , Jorma Kivilahti
DOI:
关键词: Mechanical engineering 、 Manufacturing engineering 、 Coating 、 Engineering 、 Electronics 、 Electronics manufacturing 、 High density 、 Adhesive
摘要: This work contains the proceedings of Fourth International Conference on Adhesives Joining and Coating Technology in Electronics Manufacturing. The papers cover: novel applications; reliability; high density substrates; materials development; ICA performance; more.
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