An electro-fluidic assembly technique for integration of III-V devices onto silicon
作者： C.D. Nordquist , P.A. Smith , T.S. Mayer
关键词: Fluidics 、 Materials science 、 Silicon 、 Electric field 、 Process (computing) 、 Carrier fluid 、 Die (integrated circuit) 、 Nanotechnology 、 Si substrate 、 Electrohydrodynamics
摘要: This paper introduces an electro-fluidic assembly approach that provides a potential route towards low-cost, parallel heterogeneous integration process suitable for III-V device integration. In this process, nonuniform electric fields are used to attract devices from carrier fluid Si substrate patterned with predefined alignment locations. We have demonstrated the utility of by assembling Au die using circular apertures defined on oxidized substrate.
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