Workpiece with Semiconductor Chips, Semiconductor Device and Method for Producing a Workpiece with Semiconductor Chips
作者： Ralf Plieninger , Markus Brunnbauer , Stephan Bradl , Jens Pohl , Recai Sezi
DOI:
关键词: Molding (process) 、 Electronic engineering 、 Semiconductor chip 、 Materials science 、 Semiconductor device 、 Layer (electronics) 、 Optoelectronics 、 Semiconductor
摘要: A workpiece has at least two semiconductor chips, each chip having a first main surface, which is partially exposed, and second surface. The also comprises an electrically conducting layer, arranged on the layer being regions of molding compound, layer.
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