Porous silicon process for encapsulated single-crystal surface-micromachined microstructures

摘要: This paper describes a 10-mask process for fabricating single crystal, surface micromachined devices by using porous silicon as sacrificial layer, and an n-type epitaxial layer structural material. Single crystal structures have the important advantage over polysilicon of precisely controlled material properties, in particular Young's Modulus residual strain. Additionally, is suitable integrating circuitry, provides promising alternative integrated microsystems. results with similar flexibility device design to process, but control bulk technology. The also includes provisions encapsulation vacuum reactive sealing microstructure LPCVD layer. Although this technology versatile can be used variety microstructures, primary demonstration vehicles research effort been resonators. Some key problems processes include: dimensional region; creating high aspect ratio eliminating defects induced remaining structure; protection oxidized from etching prior etch.© (1999) COPYRIGHT SPIE--The International Society Optical Engineering. Downloading abstract permitted personal use only.