Adhesive substrate and method for using
作者： Edward Prack
DOI:
关键词: Adhesion 、 Degree Celsius 、 Composite material 、 Materials science 、 Solvent 、 Adhesive 、 Substrate (printing)
摘要: A system, apparatus and method of using an adhesive substrate capable maintaining adhesion between a carrier work piece during thinning process then withstanding processing temperatures equal to or in excess 160 degrees Celsius with subsequent removal the without solvent are described herein.
lens.org 参考文章(9)
Edward R. Prack, Treliant Fang, Frank W. Fischer, Method of manufacturing a semiconductor component and polyimide etchant therefor ,(2003)
Masazumi Amagai, Norito Umehara, Kazuyoshi Ebe, Mamoru Kobayashi, Wafer dicing/bonding sheet and process for producing semiconductor device ,(1997)
David G. Wontor, Marc Alan Mangrum, Robert J. Wenzel, George R. Leal, Jie-Hua Zhao, Brian D. Sawyer, Edward R. Prack, Circuit device with at least partial packaging, exposed active surface and a voltage reference plane ,(2003)
Xiao-Chun Mu, Quat T. Vu, Qing Ma, Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby ,(2002)
David G. Wontor, Marc Alan Mangrum, Robert J. Wenzel, George R. Leal, Jie-Hua Zhao, Brian D. Sawyer, Edward R. Prack, Circuit device with at least partial packaging and method for forming ,(2004)
Hideo Kuroda, Masao Taniguchi, A pressure sensitive adhesive and a pressure sensitive adhesive film having thereon a layer of the same ,(1986)
David Grapotte, Alain Goux, Adhesive tape resistant to high temperatures ,(2004)
Hidekazu Matsuura, Yoshiyuki Tanabe, Adhesive film for semiconductor, lead frame and semiconductor device using the same ,(2002)
Edward R. Prack, Lei L. Mercado, James Jen-Ho Wang, Young Sir Chung, Vijay Sarihan, Semiconductor power device with shear stress compensation ,(2003)