Direct observation of NiSi lateral growth at the epitaxial θ-Ni2Si/Si(1 0 0) interface

作者: M. El Kousseifi , K. Hoummada , T. Epicier , D. Mangelinck

DOI: 10.1016/J.ACTAMAT.2015.07.062

关键词: SiliconTransmission electron microscopyLow densityCondensed matter physicsCrystallographyNickelMaterials scienceEpitaxyHigh-resolution transmission electron microscopyDirect observationPhase formation

摘要: Abstract The first stages of NiSi phase formation at the expense θ-Ni2Si and a Si substrate are investigated by transmission electron microscopy (TEM). These measurements show presence low density particles θ-Ni2Si/Si(1 0 0) interface allow their complete shape to be determined. This stage corresponds lateral growth epitaxial interface. these is in agreement with predicted models, shapes were fitted an analytical expression derived from model developed Klinger et al.

参考文章(21)
S. Gaudet, C. Coia, P. Desjardins, C. Lavoie, Metastable Phase Formation During the Reaction of Ni Films with Si(001): the Role of Texture Inheritance Journal of Applied Physics. ,vol. 107, pp. 093515- ,(2010) , 10.1063/1.3327451
D. Mangelinck, J. Y. Dai, J. S. Pan, S. K. Lahiri, Enhancement of thermal stability of NiSi films on (100)Si and (111)Si by Pt addition Applied Physics Letters. ,vol. 75, pp. 1736- 1738 ,(1999) , 10.1063/1.124803
F. Nemouchi, D. Mangelinck, C. Bergman, P. Gas, Ulf Smith, Differential scanning calorimetry analysis of the linear parabolic growth of nanometric Ni silicide thin films on a Si substrate Applied Physics Letters. ,vol. 86, pp. 041903- ,(2005) , 10.1063/1.1852727
K. R. Coffey, K. Barmak, D. A. Rudman, S. Foner, Thin film reaction kinetics of niobium/aluminum multilayers Journal of Applied Physics. ,vol. 72, pp. 1341- 1349 ,(1992) , 10.1063/1.351744
L. Klinger, Y. Bréchet, G. Purdy, On the kinetics of interface-diffusion-controlled peritectoid reactions Acta Materialia. ,vol. 46, pp. 2617- 2621 ,(1998) , 10.1016/S1359-6454(97)00471-0
Chuang T′e-Jer, James R. Rice, The shape of intergranular creep cracks gro′ing by surface diffusion Acta Metallurgica. ,vol. 21, pp. 1625- 1628 ,(1973) , 10.1016/0001-6160(73)90105-3
C. Lavoie, F.M. d’Heurle, C. Detavernier, C. Cabral, Towards implementation of a nickel silicide process for CMOS technologies Microelectronic Engineering. ,vol. 70, pp. 144- 157 ,(2003) , 10.1016/S0167-9317(03)00380-0
G Lucenko, A Gusak, None, A model of the growth of intermediate phase islands in multilayers Microelectronic Engineering. ,vol. 70, pp. 529- 532 ,(2003) , 10.1016/S0167-9317(03)00432-5