Method for identifying and using process window signature patterns for lithography process control

作者: Shauh-Teh Juang , James Wiley , Jun Ye , Xun Chen , Moshe E. Preil

DOI:

关键词: Real-time computingChipControl (management)Pattern recognitionSignature (logic)Artificial intelligenceSet (abstract data type)WaferEngineeringProcess (computing)Work in processProcess window

摘要: A method for identifying process window signature patterns in a device area of mask is disclosed. The collectively provide unique response to changes set condition parameters the lithography process. enable monitoring associated signs drift, analyzing determine which are limiting and affecting chip yields, corrections that should be fed back into or forwarded an etch process, specific masks do not transfer intended pattern wafers as intended, groups share common characteristics behave similar manner with respect when transferring wafer.

参考文章(19)
Virendra N. Mahajan, Aberration Theory Made Simple ,(1991)
Michael E. Littau, Christopher J. Raymond, Determination of center of focus by cross-section analysis ,(2002)
Timothy A. Brunner, Carlos Fonseca, Nakgeuon Seong, Martin Burkhardt, Impact of resist blur on MEF, OPC, and CD control Optical Microlithography XVII. ,vol. 5377, pp. 141- 149 ,(2004) , 10.1117/12.537472
John A. Allgair, Michelle Ivy, Kevin Lucas, John L. Sturtevant, Richard C. Elliott, Chris A. Mack, Craig W. MacNaughton, John D. Miller, Mike Pochkowski, Moshe E. Preil, John C. Robinson, Frank Santos, Characterization of optical proximity correction features Metrology, inspection, and process control for microlothoggraphy. Conference. ,vol. 4344, pp. 200- 207 ,(2001) , 10.1117/12.436743
Vincent Wiaux, Vicky Philipsen, Rik M. Jonckheere, Geert Vandenberghe, Staf Verhaegen, Thomas Hoffmann, Kurt G. Ronse, William B. Howard, Wilhelm Maurer, Moshe E. Preil, Assessment of OPC effectiveness using two-dimensional metrics SPIE's 27th Annual International Symposium on Microlithography. ,vol. 4691, pp. 395- 406 ,(2002) , 10.1117/12.474588