作者: Shauh-Teh Juang , James Wiley , Jun Ye , Xun Chen , Moshe E. Preil
DOI:
关键词: Real-time computing 、 Chip 、 Control (management) 、 Pattern recognition 、 Signature (logic) 、 Artificial intelligence 、 Set (abstract data type) 、 Wafer 、 Engineering 、 Process (computing) 、 Work in process 、 Process window
摘要: A method for identifying process window signature patterns in a device area of mask is disclosed. The collectively provide unique response to changes set condition parameters the lithography process. enable monitoring associated signs drift, analyzing determine which are limiting and affecting chip yields, corrections that should be fed back into or forwarded an etch process, specific masks do not transfer intended pattern wafers as intended, groups share common characteristics behave similar manner with respect when transferring wafer.