Methods and apparatus for electropolishing metal interconnections on semiconductor devices
作者： Hui Wang
DOI:
关键词: Layer (electronics) 、 Cathode 、 Wafer 、 Electrolyte 、 Electropolishing 、 Materials science 、 Current (fluid) 、 Metallurgy 、 Polishing 、 Optoelectronics 、 Semiconductor device
摘要: An electropolishing apparatus for polishing a metal layer formed on wafer (31) includes an electrolyte (34), receptacle (100), chuck (29), fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The (29) holds positions the within (100). (34) is delivered through 9) into 3) then applies current to electropolish (31). In accordance with aspect of present invention, discrete portions can be electropolished enhance uniformity wafer.
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