Three-dimensional surface structure inspection device e.g. for surface mount technology (SMT) circuit board solder application
作者： Ludwig Listl , Hubert Bellm
DOI:
关键词: Surface (mathematics) 、 Calibration 、 Surface geometry 、 Position (vector) 、 Test item 、 Engineering 、 Surface-mount technology 、 Acoustics 、 Printed circuit board 、 Electronic engineering 、 Soldering
摘要: An inspection device examines three-dimensional surface structures of mainly flat test items (3) by means a camera (8). optical sensor (7) is provided for carrying out detection at least part-zone the item surface, with and (8) combined in unit (6). A calibration mark (16) fixed on independent test-item enables position to be determined after photographing an object or measuring (16).
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