作者: M. H. F. Overwijk
DOI: 10.1116/1.586537
关键词: Transmission electron microscopy 、 Nanotechnology 、 Sputtering 、 Materials science 、 Resolution (electron density) 、 Focused ion beam 、 Substrate (electronics) 、 Ion beam 、 Sample preparation 、 Optoelectronics 、 Wafer
摘要: A novel scheme is presented for the preparation of cross‐section transmission electron microscopy (TEM) specimens, with a focused ion beam (FIB). This particularly suitable highly structured substrates, such as integrated circuits. The specimen made by cutting thin slice material from substrate sputtering FIB. position can be selected submicron resolution. subsequently removed and transported to standard TEM‐specimen holder. specimen, ready TEM inspection, prepared within 2 hs. samples are excellent quality illustrated images FIB‐made specimens an electrically programmable read‐only memory.