Component-based workflows for parallel thermomechanical analysis of arrayed geometries
作者： Max O. Bloomfield , Zhen Li , Brian Granzow , Daniel A. Ibanez , Assad A. Oberai
DOI: 10.1007/S00366-016-0487-5
关键词: Engineering design process 、 Workflow 、 Component (UML) 、 Edge (geometry) 、 Process (computing) 、 Computational science 、 Soldering 、 Simulation 、 Engineering 、 Mesh generation 、 Microelectronics
摘要: Component-based simulation workflows can increase the agility of design process by streamlining adaptation new methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in thermomechanical analysis an array solder joints used microelectronics fabrication. automate from problem specification to solution underlying PDEs, including setup, domain definition, mesh generation. establish utility proposed approach demonstrating that qualitatively different stress concentrations are seen near center a joint at edge same array.
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