Panel for forming a floor covering
作者： Martin Segaert , Bernard Thiers , Laurent Meersseman
DOI:
关键词: Materials science 、 Floor covering 、 Layer (electronics) 、 Lateral surface 、 Composite material 、 Undercut 、 Structural engineering 、 Substrate (printing)
摘要: Panel for forming a floor covering, comprising substrate (6) and top layer (7), wherein the panel (1), at edges (2-3), is provided with coupling means (18), respective (2-3) comprises profile (26) on these two profiles moisture-repellent or sealing covering (27) provided, this extends over concerned least up to lateral surface (28) of said characterized in that (27), one partially an undercut (29) performed (28).
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