Method and apparatus for examining printed circuit board provided with miniaturized electronic parts
作者： Ryuhachirou Douji , Kiyomu Chiyoda , Etsuji Suzuki , Shinichi Uno
DOI:
关键词: Image sensor 、 Microprocessor 、 Light beam 、 Lens (optics) 、 Soldering 、 Printed circuit board 、 Engineering 、 Optics 、 Reflection (physics) 、 Chip
摘要: The rear and front surfaces of a printed circuit board are illuminated by parallel light beams from first second illuminating systems, respectively. obtained transmitted reflected received an image sensor through lens system to provide video data which is stored in memory. Abrasion scars formed brushing the terminals on surface prior soldering. presence or absence chip element discriminated microprocessor accordance with difference between reflection factors emitted element.
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