The Copper Damascene Process and Chemical Mechanical Polishing
作者： Tapan Gupta
DOI: 10.1007/978-1-4419-0076-0_6
关键词: Metallurgy 、 Barrier layer 、 Chemical-mechanical planarization 、 Scientific method 、 Copper damascene 、 Materials science 、 Hard mask
摘要:
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sci-hub.st 参考文章(59)
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