Finite element analysis for solder ball connect (SBC) structural design optimization
作者： J. S. Corbin
DOI: 10.1147/RD.375.0585
关键词: Electronic packaging 、 Materials science 、 Soldering 、 Interconnection 、 Finite element method 、 Power cycling 、 Structural engineering 、 Ceramic 、 Design of experiments 、 Temperature cycling 、 Mechanical engineering
摘要: … accelerated thermal cycle testing fatigue data. These models, therefore, provide an excellent vehicle for predicting the influence of structural modifications on fatigue reliability. …
sci-hub.se 参考文章(10)
M. ROBERT, LEON M. KEER, An elastic circular cylinder with prescribed displacements at the ends ― Asymmetric case Quarterly Journal of Mechanics and Applied Mathematics. ,vol. 40, pp. 365- 381 ,(1987) , 10.1093/QJMAM/40.3.365
T. J. Dolan, S. S. Manson, Thermal Stress and Low Cycle Fatigue ,(1981)
K. C. Norris, A. H. Landzberg, Reliability of controlled collapse interconnections Ibm Journal of Research and Development. ,vol. 13, pp. 266- 271 ,(1969) , 10.1147/RD.133.0266
M. D. Ries, D. R. Banks, D. P. Watson, K. G. Hoebener, Attachment of solder ball connect (SBC) packages to circuit cards Ibm Journal of Research and Development. ,vol. 37, pp. 597- 608 ,(1993) , 10.1147/RD.375.0597
Y. Guo, C. K. Lim, W. T. Chen, C. G. Woychik, Solder ball connect (SBC) assemblies under thermal loading: I. deformation measurement via moiré interferometry, and its interpretation Ibm Journal of Research and Development. ,vol. 37, pp. 635- 647 ,(1993) , 10.1147/RD.375.0635
W. T. Chen, C. W. Nelson, Thermal stress in bonded joints Ibm Journal of Research and Development. ,vol. 23, pp. 179- 188 ,(1979) , 10.1147/RD.232.0179
L. S. Goldmann, Geometric optimization of controlled collapse interconnections Ibm Journal of Research and Development. ,vol. 13, pp. 251- 265 ,(1969) , 10.1147/RD.133.0251
T. Kamei, M. Nakamura, H. Ariyoshi, M. Doken, Hybrid IC Structures Using Solder Reflow Technology IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 2, pp. 208- 217 ,(1979) , 10.1109/TCHMT.1979.1135453
George E.P. Box, William G. Hunter, J. Stuart Hunter, Statistics for experimenters : an introduction to design, data analysis, and model building Statistics for experimenters : an introduction to design. ,(1978)
P. Hall, Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 7, pp. 314- 327 ,(1984) , 10.1109/TCHMT.1984.1136384