作者: C. A. Neugebauer
DOI: 10.1063/1.1735751
关键词: Deposition (law) 、 Dislocation 、 Evaporation (deposition) 、 Crystallography 、 Materials science 、 Substrate (electronics) 、 Ultimate tensile strength 、 Composite material 、 Creep 、 Diffraction 、 Whiskers
摘要: Evaporated gold films in the 500–15 000 A thickness range were prepared on rocksalt substrates. Depending temperature of substrate during deposition, completely, partially, or randomly oriented with respect to (100) plane rocksalt, as determined by x‐ray diffraction. The stress‐strain curve free was investigated and found be quite steep up very high stresses, but plastic deformation creep observed even at relatively low stresses. ultimate tensile strength is from 2 4 times that annealed bulk material not a function film thickness. Young's moduli are normal. Comparing behavior evaporated whiskers suggests former owe their concentration defects which uniformly quenched evaporation process, greatly impede dislocation motion multiplication, an abnormally stress requi...