Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations
作者： Yongle Huang , Hongfei Deng , Yifei Luo , Fei Xiao , Binli Liu
关键词: Reliability (semiconductor) 、 Insulated-gate bipolar transistor 、 Composite material 、 Die (integrated circuit) 、 Accelerated aging 、 Deformation (engineering) 、 Viscoplasticity 、 Soldering 、 Stress (mechanics) 、 Materials science
摘要: … electro-thermal-mechanical coupled model. Results indicated that local viscoplastic deformation of solder alloys around stress concentrated areas caused by material microdefects is …
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