作者: Xuezhe Zheng , Dinesh Patil , Jon Lexau , Frankie Liu , Guoliang Li
DOI: 10.1364/OE.19.005172
关键词: Hybrid silicon laser 、 Extinction ratio 、 Optoelectronics 、 Materials science 、 Photonic integrated circuit 、 Stepper 、 Photolithography 、 CMOS 、 Silicon photonics 、 Optics 、 Photonics
摘要: Using low parasitic microsolder bumping, we hybrid integrated efficient photonic devices from different platforms with advanced 40 nm CMOS VLSI circuits to build ultra-low power …